型号 | Most Relevant | Technical | Compliance | Operating Conditions | Physical | Dimensions | Other | ||||||||||||||||||||||||||||||||||||||||
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数据手册 |
单价/库存
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风险等级 |
是否无铅
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是否Rohs认证
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生命周期
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标称供电电压 | 技术 | 运营商类型 | 运营商类型(2) | 功能数量 |
最大压摆率
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温度等级
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电信集成电路类型
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JESD-30 代码 | JESD-609代码 |
认证状态
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湿度敏感等级 | 最高工作温度 | 最低工作温度 |
峰值回流温度(摄氏度)
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处于峰值回流温度下的最长时间
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端子数量 | 封装主体材料 | 封装代码 | 封装等效代码 |
封装形状
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封装形式
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表面贴装
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端子面层
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端子形式
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端子节距
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端子位置
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宽度
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长度 |
座面最大高度
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mfrid
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包装说明
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是否符合REACH标准
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HTS代码
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零件包装代码
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针数
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Country Of Origin
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YTEOL
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ECCN代码
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Source Content uid
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CN8394KTF
Synaptics Incorporated
|
查询价格和库存 |
|
No | Active | 3.3 V | CMOS | 16 | 90 mA | COMMERCIAL | FRAMER | R-PQFP-G128 | e0 | Not Qualified | 70 °C | 128 | PLASTIC/EPOXY | QFP | QFP128,.63X.87,20 | RECTANGULAR | FLATPACK | YES | Tin/Lead (Sn/Pb) | GULL WING | 500 µm | QUAD | 223327797 | QFP, QFP128,.63X.87,20 | compliant | 8542.39.00.01 | ||||||||||||||||||
CN8398KBG
Synaptics Incorporated
|
查询价格和库存 |
|
No | Active | 3.3 V | CMOS | 16 | 155 mA | COMMERCIAL | FRAMER | S-XBGA-B272 | e0 | Not Qualified | 70 °C | 272 | CERAMIC | BGA | BGA272,20X20,50 | SQUARE | GRID ARRAY | YES | Tin/Lead (Sn/Pb) | BALL | 1.27 mm | BOTTOM | 223327797 | BGA, BGA272,20X20,50 | compliant | 8542.39.00.01 | ||||||||||||||||||
BT8330EPF
Synaptics Incorporated
|
查询价格和库存 |
|
No | Active | 5 V | CMOS | 1 | 175 mA | INDUSTRIAL | FRAMER | S-PQFP-G80 | e0 | Not Qualified | 85 °C | -40 °C | 80 | PLASTIC/EPOXY | QFP | QFP80,.7SQ | SQUARE | FLATPACK | YES | Tin/Lead (Sn/Pb) | GULL WING | 635 µm | QUAD | 223327797 | QFP, QFP80,.7SQ | compliant | 8542.39.00.01 | |||||||||||||||||
MT9079AP
Microsemi Corporation
|
查询价格和库存 |
|
No | Transferred | 5 V | CMOS | 1 | 7 mA | INDUSTRIAL | FRAMER | S-PQCC-J44 | e0 | Not Qualified | 85 °C | -40 °C | 44 | PLASTIC/EPOXY | QCCJ | LDCC44,.7SQ | SQUARE | CHIP CARRIER | YES | Tin/Lead (Sn/Pb) | J BEND | 1.27 mm | QUAD | 2192 | QCCJ, LDCC44,.7SQ | unknown | 8542.39.00.01 | LPCC | 44 | |||||||||||||||
MT8977AP
Microsemi Corporation
|
查询价格和库存 |
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No | No | Transferred | 5 V | CMOS | 1 | 10 mA | INDUSTRIAL | FRAMER | S-PQCC-J44 | e0 | Not Qualified | 85 °C | -40 °C | 44 | PLASTIC/EPOXY | QCCJ | LDCC44,.7SQ | SQUARE | CHIP CARRIER | YES | Tin/Lead (Sn/Pb) | J BEND | 1.27 mm | QUAD | 2192 | unknown | 8542.39.00.01 | LPCC | 44 | |||||||||||||||
DS3173+
Maxim Integrated Products
|
查询价格和库存 |
|
Yes | Yes | Transferred | 3.3 V | 1 | 449 µA | COMMERCIAL | FRAMER | S-PBGA-B400 | e1 | Not Qualified | 70 °C | 400 | PLASTIC/EPOXY | BGA | BGA400,20X20,50 | SQUARE | GRID ARRAY | YES | TIN SILVER COPPER | BALL | 1.27 mm | BOTTOM | 27 mm | 27 mm | 2.54 mm | 2164 | BGA, BGA400,20X20,50 | compliant | 8542.39.00.01 | BGA | 400 | Japan, Mainland China, Malaysia, Philipp... more | 9 | |||||||||||
DS3173N+
Maxim Integrated Products
|
查询价格和库存 |
|
Yes | Yes | Transferred | 3.3 V | 1 | 449 µA | INDUSTRIAL | FRAMER | S-PBGA-B400 | e1 | Not Qualified | 85 °C | -40 °C | 400 | PLASTIC/EPOXY | BGA | BGA400,20X20,50 | SQUARE | GRID ARRAY | YES | TIN SILVER COPPER | BALL | 1.27 mm | BOTTOM | 27 mm | 27 mm | 2.54 mm | 2164 | 27 X 27 MM, 1.27 MM PITCH, LEAD FREE, CSBGA-400 | compliant | 8542.39.00.01 | BGA | 400 | ||||||||||||
PM5326-FEI
Microchip Technology Inc
|
查询价格和库存 |
|
Active | 1.2 V | 1 | FRAMER | S-PBGA-B1292 | 1292 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | BALL | BOTTOM | 2188 | FCBGA-1292 | compliant | 8542.31.00.01 | 5A991.B | |||||||||||||||||||||||||||
DS26518GN
Maxim Integrated Products
|
查询价格和库存 |
|
No | No | Transferred | 1.8 V | CEPT PCM-30/E-1 | T-1(DS1) | 1 | 450 µA | INDUSTRIAL | FRAMER | S-PBGA-B256 | Not Qualified | 3 | 85 °C | -40 °C | 245 | 256 | PLASTIC/EPOXY | BGA | BGA256,16X16,40 | SQUARE | GRID ARRAY | YES | BALL | 1 mm | BOTTOM | 17 mm | 17 mm | 1.76 mm | 2164 | BGA, BGA256,16X16,40 | not_compliant | 8542.39.00.01 | BGA | 256 | Japan, Mainland China, Malaysia, Philipp... more | 3 | EAR99 | |||||||
PM8310A-FXI
Microchip Technology Inc
|
查询价格和库存 |
|
Active | 2188 | HBGA-896 | compliant | |||||||||||||||||||||||||||||||||||||||||
PM8318-FXI
Microchip Technology Inc
|
查询价格和库存 |
|
Active | CMOS | 1 | FRAMER | S-PBGA-B480 | 480 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | BALL | BOTTOM | 2188 | BBGA-480 | compliant | 8542.31.00.01 | 5A991.B | |||||||||||||||||||||||||||
IDT82V8313BBG
Integrated Device Technology Inc
|
查询价格和库存 |
|
Yes | Yes | Transferred | 3.3 V | 1 | INDUSTRIAL | FRAMER | S-PBGA-B208 | e1 | Not Qualified | 3 | 85 °C | -40 °C | 208 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 17 mm | 17 mm | 1.97 mm | 2068 | 17 X 17 MM, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-208 | compliant | 8542.39.00.01 | BGA | 208 | IDT82V8313BBG | ||||||||||||
PM4351-RGI
Microsemi Corporation
|
查询价格和库存 |
|
Yes | Transferred | 3.3 V | CMOS | CEPT PCM-30/E-1 | T-1(DS1) | 1 | INDUSTRIAL | FRAMER | S-PQFP-G80 | Not Qualified | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 80 | PLASTIC/EPOXY | QFP | QFP80,.7SQ | SQUARE | FLATPACK | YES | GULL WING | 650 µm | QUAD | 14 mm | 14 mm | 2.35 mm | 2192 | QFP, QFP80,.7SQ | compliant | 8542.39.00.01 | |||||||||||||
T8100A--BAL3-DB
LSI Corporation
|
查询价格和库存 |
|
No | Transferred | 3.3 V | 1 | INDUSTRIAL | TIME SLOT ASSIGNER | S-PBGA-B217 | Not Qualified | 85 °C | -40 °C | 217 | PLASTIC/EPOXY | SQUARE | GRID ARRAY | YES | BALL | BOTTOM | 2145 | , | unknown | 8542.39.00.01 | BGA | 217 | ||||||||||||||||||||||
T8102---SC3-DB
LSI Corporation
|
查询价格和库存 |
|
No | Transferred | 3.3 V | 1 | COMMERCIAL | TIME SLOT ASSIGNER | S-PQFP-G208 | Not Qualified | 70 °C | 208 | PLASTIC/EPOXY | SQUARE | FLATPACK | YES | GULL WING | QUAD | 2145 | , | unknown | 8542.39.00.01 | QFP | 208 | |||||||||||||||||||||||
PM4351-NGI
Microsemi Corporation
|
查询价格和库存 |
|
Yes | Transferred | 3.3 V | CMOS | CEPT PCM-30/E-1 | T-1(DS1) | 1 | INDUSTRIAL | FRAMER | S-PBGA-B81 | e1 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 30 | 81 | PLASTIC/EPOXY | LFBGA | BGA81,9X9,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 800 µm | BOTTOM | 9 mm | 9 mm | 1.5 mm | 2192 | 9 X 9 MM, 1.40 MM HEIGHT, CABGA-81 | not_compliant | 8542.39.00.01 | ||||||||||
DS2155G/T
Maxim Integrated Products
|
查询价格和库存 |
|
No | No | Transferred | 3.3 V | 1 | COMMERCIAL | FRAMER | S-PBGA-B100 | e0 | Not Qualified | 70 °C | 100 | PLASTIC/EPOXY | FBGA | SQUARE | GRID ARRAY, FINE PITCH | YES | TIN LEAD | BALL | 800 µm | BOTTOM | 10 mm | 10 mm | 2164 | FBGA, | compliant | 8542.39.00.01 | BGA | 100 | Japan, Mainland China, Malaysia, Philipp... more | 9 | ||||||||||||||
MT9076AB
Microsemi Corporation
|
查询价格和库存 |
|
Transferred | 3.3 V | 1 | INDUSTRIAL | FRAMER | S-PQFP-G80 | Not Qualified | 85 °C | -40 °C | 80 | PLASTIC/EPOXY | SQUARE | FLATPACK | YES | GULL WING | QUAD | 2192 | LQFP-80 | unknown | 8542.39.00.01 | QFP | 80 | |||||||||||||||||||||||
MT9072AV
Microsemi Corporation
|
查询价格和库存 |
|
No | Transferred | 3.3 V | 8 | INDUSTRIAL | FRAMER | S-PBGA-B256 | Not Qualified | 85 °C | -40 °C | 256 | PLASTIC/EPOXY | SQUARE | GRID ARRAY | YES | BALL | BOTTOM | 2192 | LBGA-256 | unknown | 8542.39.00.01 | BGA | 220 | ||||||||||||||||||||||
MT9076AP
Microsemi Corporation
|
查询价格和库存 |
|
Transferred | 3.3 V | 1 | INDUSTRIAL | FRAMER | S-PQCC-J68 | Not Qualified | 85 °C | -40 °C | 68 | PLASTIC/EPOXY | SQUARE | CHIP CARRIER | YES | J BEND | QUAD | 2192 | , | unknown | 8542.39.00.01 | LCC | 68 |