数字传输控制器封装型号_数字传输控制器厂家价格-bom2buy

型号

型号						Most Relevant			Technical					Compliance			Operating Conditions					Physical											Dimensions			Other
型号	数据手册	单价/库存	风险等级	是否无铅	是否Rohs认证	生命周期	标称供电电压	技术	运营商类型	运营商类型（2）	功能数量	最大压摆率	温度等级	电信集成电路类型	JESD-30 代码	JESD-609代码	认证状态	湿度敏感等级	最高工作温度	最低工作温度	峰值回流温度（摄氏度）	处于峰值回流温度下的最长时间	端子数量	封装主体材料	封装代码	封装等效代码	封装形状	封装形式	表面贴装	端子面层	端子形式	端子节距	端子位置	宽度	长度	座面最大高度	mfrid	包装说明	是否符合REACH标准	HTS代码	零件包装代码	针数	Country Of Origin	ECCN代码	YTEOL
FLIXF3204BEC0SE001 Inphi Corporation		查询价格和库存				Transferred	1.8 V	CMOS			1		INDUSTRIAL	FRAMER	S-PBGA-B256		Not Qualified		85 °C	-40 °C			256	PLASTIC/EPOXY	BGA		SQUARE	GRID ARRAY	YES		BALL	1 mm	BOTTOM	17 mm	17 mm	1.8 mm	116151958	BGA,	compliant	8542.39.00.01
FLIXF3204BEC0SE000 Inphi Corporation		查询价格和库存				Transferred	1.8 V	CMOS			1		INDUSTRIAL	FRAMER	S-PBGA-B256		Not Qualified		85 °C	-40 °C			256	PLASTIC/EPOXY	BGA		SQUARE	GRID ARRAY	YES		BALL	1 mm	BOTTOM	17 mm	17 mm	1.8 mm	116151958	BGA,	compliant	8542.39.00.01
DS26514GN+ Maxim Integrated Products		查询价格和库存		Yes	Yes	Transferred	1.8 V		CEPT PCM-30/E-1	T-1(DS1)	1	250 µA	INDUSTRIAL	FRAMER	S-PBGA-B256	e1	Not Qualified	3	85 °C	-40 °C	260	30	256	PLASTIC/EPOXY	BGA	BGA256,16X16,40	SQUARE	GRID ARRAY	YES	TIN SILVER COPPER	BALL	1 mm	BOTTOM	17 mm	17 mm	1.76 mm	2164	BGA, BGA256,16X16,40	compliant	8542.39.00.01	BGA	256	Japan, Mainland China, Malaysia, Philipp... more	EAR99	3
DS2155GN+ Maxim Integrated Products		查询价格和库存		Yes	Yes	Transferred	3.3 V				1		INDUSTRIAL	FRAMER	S-PBGA-B100	e1	Not Qualified		85 °C	-40 °C			100	PLASTIC/EPOXY	LFBGA		SQUARE	GRID ARRAY, LOW PROFILE, FINE PITCH	YES	TIN SILVER COPPER	BALL	800 µm	BOTTOM	10 mm	10 mm		2164	10 X 10 MM, 0.80 MM PITCH, ROHS COMPLIANT, CSBGA-100	compliant	8542.39.00.01	BGA	100
XRT86VL30IV80-F Exar Corporation		查询价格和库存		Yes	Yes	Transferred	1.8 V				1		INDUSTRIAL	FRAMER	S-PQFP-G80	e3	Not Qualified	3	85 °C	-40 °C			80	PLASTIC/EPOXY	LFQFP		SQUARE	FLATPACK, LOW PROFILE, FINE PITCH	YES	MATTE TIN	GULL WING	500 µm	QUAD	12 mm	12 mm	1.6 mm	1972	LFQFP,	compliant	8542.39.00.01	QFP	80
XRT86VL30IV-F Exar Corporation		查询价格和库存		Yes	Yes	Transferred	1.8 V				1		INDUSTRIAL	FRAMER	R-PQFP-G128	e3	Not Qualified	3	85 °C	-40 °C			128	PLASTIC/EPOXY	LFQFP		RECTANGULAR	FLATPACK, LOW PROFILE, FINE PITCH	YES	MATTE TIN	GULL WING	500 µm	QUAD	14 mm	20 mm	1.6 mm	1972	14 X 20 MM, 1.40 MM HEIGHT, GREEN, LQFP-128	compliant	8542.39.00.01	QFP	128
MT9075BPR1 Microsemi Corporation		查询价格和库存		Yes	Yes	Transferred	5 V	CMOS	CEPT PCM-30/E-1		1	150 mA	INDUSTRIAL	FRAMER	S-PQCC-J68	e3	Not Qualified		85 °C	-40 °C			68	PLASTIC/EPOXY	QCCJ	LDCC68,1.0SQ	SQUARE	CHIP CARRIER	YES	MATTE TIN	J BEND	1.27 mm	QUAD	24.23 mm	24.23 mm	4.57 mm	2192	LEAD FREE, PLASTIC, MS-018AE, LCC-68	compliant	8542.39.00.01	LCC	68
MT9074AL1 Microsemi Corporation		查询价格和库存		Yes	Yes	Transferred	5 V		CEPT PCM-30/E-1	T-1(DS1)	1	200 mA	INDUSTRIAL	FRAMER	R-PQFP-G100	e3	Not Qualified		85 °C	-40 °C			100	PLASTIC/EPOXY	QFP	QFP100,.7X1.0	RECTANGULAR	FLATPACK	YES	MATTE TIN	GULL WING	650 µm	QUAD	14 mm	20 mm	3.4 mm	2192	14 X 20 MM, 2.80 MM HEIGHT, LEAD FREE, MO-112CC-1, MQFP-100	compliant	8542.39.00.01	QFP	100
MT8979APR Microsemi Corporation		查询价格和库存		No	No	Transferred	5 V	CMOS	CEPT PCM-30/E-1		1	16 mA	INDUSTRIAL	FRAMER	S-PQCC-J44	e0	Not Qualified		85 °C	-40 °C			44	PLASTIC/EPOXY	QCCJ	LDCC44,.7SQ	SQUARE	CHIP CARRIER	YES	TIN LEAD	J BEND	1.27 mm	QUAD	16.585 mm	16.585 mm	4.57 mm	2192	PLASTIC, MS-018AC, LCC-44	unknown	8542.39.00.01	LPCC	44
MT9074APR1 Microsemi Corporation		查询价格和库存		Yes	Yes	Transferred	5 V		CEPT PCM-30/E-1	T-1(DS1)	1	200 mA	INDUSTRIAL	FRAMER	S-PQCC-J68	e3	Not Qualified		85 °C	-40 °C			68	PLASTIC/EPOXY	QCCJ	LDCC68,1.0SQ	SQUARE	CHIP CARRIER	YES	MATTE TIN	J BEND	1.27 mm	QUAD	24.23 mm	24.23 mm	4.57 mm	2192	LEAD FREE, PLASTIC, MS-018AE, LCC-68	compliant	8542.39.00.01	LCC	68
MT8976AP Microsemi Corporation		查询价格和库存		No	No	Transferred	5 V	CMOS			1	10 mA	INDUSTRIAL	FRAMER	S-PQCC-J44	e0	Not Qualified		85 °C	-40 °C			44	PLASTIC/EPOXY	QCCJ	LDCC44,.7SQ	SQUARE	CHIP CARRIER	YES	Tin/Lead (Sn/Pb)	J BEND	1.27 mm	QUAD				2192	QCCJ, LDCC44,.7SQ	unknown	8542.39.00.01	LPCC	44
PM4358-NGI Microsemi Corporation		查询价格和库存			Yes	Transferred	1.8 V	CMOS			1		INDUSTRIAL	FRAMER	S-PBGA-B256			3	85 °C	-40 °C			256	PLASTIC/EPOXY	BGA		SQUARE	GRID ARRAY	YES		BALL		BOTTOM				2192	BGA,	compliant	8542.39.00.01
MT9074AP1 Microsemi Corporation		查询价格和库存		Yes	Yes	Transferred	5 V		CEPT PCM-30/E-1	T-1(DS1)	1	200 mA	INDUSTRIAL	FRAMER	S-PQCC-J68	e3	Not Qualified		85 °C	-40 °C			68	PLASTIC/EPOXY	QCCJ	LDCC68,1.0SQ	SQUARE	CHIP CARRIER	YES	MATTE TIN	J BEND	1.27 mm	QUAD	24.23 mm	24.23 mm	4.57 mm	2192	LEAD FREE, PLASTIC, MS-018AE, LCC-68	compliant	8542.39.00.01	LCC	68
L-T-8105---SC4-DB LSI Corporation		查询价格和库存		Yes	Yes	Transferred	3.3 V				1	275 µA	COMMERCIAL	TIME SLOT ASSIGNER	S-PQFP-G208	e6	Not Qualified		70 °C				208	PLASTIC/EPOXY	FQFP	QFP208,1.2SQ,20	SQUARE	FLATPACK, FINE PITCH	YES	TIN BISMUTH	GULL WING	500 µm	QUAD	28 mm	28 mm	4.1 mm	2145	FQFP, QFP208,1.2SQ,20	compliant	8542.39.00.01	QFP	208
L-T-8105---BAL4-DB LSI Corporation		查询价格和库存		Yes	Yes	Transferred	3.3 V				1	275 µA	INDUSTRIAL	TIME SLOT ASSIGNER	S-PBGA-B217	e1	Not Qualified		85 °C	-40 °C			217	PLASTIC/EPOXY	BGA	BGA217,17X17,50	SQUARE	GRID ARRAY	YES	TIN SILVER COPPER	BALL	1.27 mm	BOTTOM	23 mm	23 mm	2.32 mm	2145	BGA, BGA217,17X17,50	unknown	8542.39.00.01	BGA	217
L-T-8100A--BAL4-DB LSI Corporation		查询价格和库存		Yes	Yes	Transferred	3.3 V				1	275 µA	INDUSTRIAL	TIME SLOT ASSIGNER	S-PBGA-B217	e1	Not Qualified		85 °C	-40 °C			217	PLASTIC/EPOXY	BGA	BGA217,17X17,50	SQUARE	GRID ARRAY	YES	TIN SILVER COPPER	BALL	1.27 mm	BOTTOM	23 mm	23 mm	2.32 mm	2145	BGA, BGA217,17X17,50	compliant	8542.39.00.01	BGA	217
L-T-8102---SC4-DB LSI Corporation		查询价格和库存		Yes	Yes	Transferred	3.3 V				1	275 µA	COMMERCIAL	TIME SLOT ASSIGNER	S-PQFP-G208	e6	Not Qualified		70 °C				208	PLASTIC/EPOXY	FQFP	QFP208,1.2SQ,20	SQUARE	FLATPACK, FINE PITCH	YES	TIN BISMUTH	GULL WING	500 µm	QUAD	28 mm	28 mm	4.1 mm	2145	FQFP, QFP208,1.2SQ,20	compliant	8542.39.00.01	QFP	208
L-T-8100A--SC4-DB LSI Corporation		查询价格和库存		Yes	Yes	Transferred	3.3 V				1	275 µA	COMMERCIAL	TIME SLOT ASSIGNER	S-PQFP-G208	e6	Not Qualified		70 °C				208	PLASTIC/EPOXY	FQFP	QFP208,1.2SQ,20	SQUARE	FLATPACK, FINE PITCH	YES	TIN BISMUTH	GULL WING	500 µm	QUAD	28 mm	28 mm	4.1 mm	2145	FQFP, QFP208,1.2SQ,20	compliant	8542.39.00.01	QFP	208
L-T-8102---BAL4-DB LSI Corporation		查询价格和库存		Yes	Yes	Transferred	3.3 V				1	275 µA	INDUSTRIAL	TIME SLOT ASSIGNER	S-PBGA-B217	e1	Not Qualified		85 °C	-40 °C			217	PLASTIC/EPOXY	BGA	BGA217,17X17,50	SQUARE	GRID ARRAY	YES	TIN SILVER COPPER	BALL	1.27 mm	BOTTOM	23 mm	23 mm	2.32 mm	2145	BGA, BGA217,17X17,50	unknown	8542.39.00.01	BGA	217
BT8390KPF Synaptics Incorporated		查询价格和库存			No	Active	5 V	CMOS			1	175 mA	COMMERCIAL	FRAMER	R-PQFP-G128	e0	Not Qualified		70 °C				128	PLASTIC/EPOXY	QFP	QFP128,.55X.93,20	RECTANGULAR	FLATPACK	YES	Tin/Lead (Sn/Pb)	GULL WING	500 µm	QUAD				223327797	QFP, QFP128,.55X.93,20	compliant	8542.39.00.01

型号						Most Relevant			Technical					Compliance			Operating Conditions					Physical											Dimensions			Other
型号	数据手册	单价/库存	风险等级	是否无铅	是否Rohs认证	生命周期	标称供电电压	技术	运营商类型	运营商类型（2）	功能数量	最大压摆率	温度等级	电信集成电路类型	JESD-30 代码	JESD-609代码	认证状态	湿度敏感等级	最高工作温度	最低工作温度	峰值回流温度（摄氏度）	处于峰值回流温度下的最长时间	端子数量	封装主体材料	封装代码	封装等效代码	封装形状	封装形式	表面贴装	端子面层	端子形式	端子节距	端子位置	宽度	长度	座面最大高度	mfrid	包装说明	是否符合REACH标准	HTS代码	零件包装代码	针数	Country Of Origin	ECCN代码	YTEOL
FLIXF3204BEC0SE001 Inphi Corporation		查询价格和库存				Transferred	1.8 V	CMOS			1		INDUSTRIAL	FRAMER	S-PBGA-B256		Not Qualified		85 °C	-40 °C			256	PLASTIC/EPOXY	BGA		SQUARE	GRID ARRAY	YES		BALL	1 mm	BOTTOM	17 mm	17 mm	1.8 mm	116151958	BGA,	compliant	8542.39.00.01
FLIXF3204BEC0SE000 Inphi Corporation		查询价格和库存				Transferred	1.8 V	CMOS			1		INDUSTRIAL	FRAMER	S-PBGA-B256		Not Qualified		85 °C	-40 °C			256	PLASTIC/EPOXY	BGA		SQUARE	GRID ARRAY	YES		BALL	1 mm	BOTTOM	17 mm	17 mm	1.8 mm	116151958	BGA,	compliant	8542.39.00.01
DS26514GN+ Maxim Integrated Products		查询价格和库存		Yes	Yes	Transferred	1.8 V		CEPT PCM-30/E-1	T-1(DS1)	1	250 µA	INDUSTRIAL	FRAMER	S-PBGA-B256	e1	Not Qualified	3	85 °C	-40 °C	260	30	256	PLASTIC/EPOXY	BGA	BGA256,16X16,40	SQUARE	GRID ARRAY	YES	TIN SILVER COPPER	BALL	1 mm	BOTTOM	17 mm	17 mm	1.76 mm	2164	BGA, BGA256,16X16,40	compliant	8542.39.00.01	BGA	256	Japan, Mainland China, Malaysia, Philipp... more	EAR99	3
DS2155GN+ Maxim Integrated Products		查询价格和库存		Yes	Yes	Transferred	3.3 V				1		INDUSTRIAL	FRAMER	S-PBGA-B100	e1	Not Qualified		85 °C	-40 °C			100	PLASTIC/EPOXY	LFBGA		SQUARE	GRID ARRAY, LOW PROFILE, FINE PITCH	YES	TIN SILVER COPPER	BALL	800 µm	BOTTOM	10 mm	10 mm		2164	10 X 10 MM, 0.80 MM PITCH, ROHS COMPLIANT, CSBGA-100	compliant	8542.39.00.01	BGA	100
XRT86VL30IV80-F Exar Corporation		查询价格和库存		Yes	Yes	Transferred	1.8 V				1		INDUSTRIAL	FRAMER	S-PQFP-G80	e3	Not Qualified	3	85 °C	-40 °C			80	PLASTIC/EPOXY	LFQFP		SQUARE	FLATPACK, LOW PROFILE, FINE PITCH	YES	MATTE TIN	GULL WING	500 µm	QUAD	12 mm	12 mm	1.6 mm	1972	LFQFP,	compliant	8542.39.00.01	QFP	80
XRT86VL30IV-F Exar Corporation		查询价格和库存		Yes	Yes	Transferred	1.8 V				1		INDUSTRIAL	FRAMER	R-PQFP-G128	e3	Not Qualified	3	85 °C	-40 °C			128	PLASTIC/EPOXY	LFQFP		RECTANGULAR	FLATPACK, LOW PROFILE, FINE PITCH	YES	MATTE TIN	GULL WING	500 µm	QUAD	14 mm	20 mm	1.6 mm	1972	14 X 20 MM, 1.40 MM HEIGHT, GREEN, LQFP-128	compliant	8542.39.00.01	QFP	128
MT9075BPR1 Microsemi Corporation		查询价格和库存		Yes	Yes	Transferred	5 V	CMOS	CEPT PCM-30/E-1		1	150 mA	INDUSTRIAL	FRAMER	S-PQCC-J68	e3	Not Qualified		85 °C	-40 °C			68	PLASTIC/EPOXY	QCCJ	LDCC68,1.0SQ	SQUARE	CHIP CARRIER	YES	MATTE TIN	J BEND	1.27 mm	QUAD	24.23 mm	24.23 mm	4.57 mm	2192	LEAD FREE, PLASTIC, MS-018AE, LCC-68	compliant	8542.39.00.01	LCC	68
MT9074AL1 Microsemi Corporation		查询价格和库存		Yes	Yes	Transferred	5 V		CEPT PCM-30/E-1	T-1(DS1)	1	200 mA	INDUSTRIAL	FRAMER	R-PQFP-G100	e3	Not Qualified		85 °C	-40 °C			100	PLASTIC/EPOXY	QFP	QFP100,.7X1.0	RECTANGULAR	FLATPACK	YES	MATTE TIN	GULL WING	650 µm	QUAD	14 mm	20 mm	3.4 mm	2192	14 X 20 MM, 2.80 MM HEIGHT, LEAD FREE, MO-112CC-1, MQFP-100	compliant	8542.39.00.01	QFP	100
MT8979APR Microsemi Corporation		查询价格和库存		No	No	Transferred	5 V	CMOS	CEPT PCM-30/E-1		1	16 mA	INDUSTRIAL	FRAMER	S-PQCC-J44	e0	Not Qualified		85 °C	-40 °C			44	PLASTIC/EPOXY	QCCJ	LDCC44,.7SQ	SQUARE	CHIP CARRIER	YES	TIN LEAD	J BEND	1.27 mm	QUAD	16.585 mm	16.585 mm	4.57 mm	2192	PLASTIC, MS-018AC, LCC-44	unknown	8542.39.00.01	LPCC	44
MT9074APR1 Microsemi Corporation		查询价格和库存		Yes	Yes	Transferred	5 V		CEPT PCM-30/E-1	T-1(DS1)	1	200 mA	INDUSTRIAL	FRAMER	S-PQCC-J68	e3	Not Qualified		85 °C	-40 °C			68	PLASTIC/EPOXY	QCCJ	LDCC68,1.0SQ	SQUARE	CHIP CARRIER	YES	MATTE TIN	J BEND	1.27 mm	QUAD	24.23 mm	24.23 mm	4.57 mm	2192	LEAD FREE, PLASTIC, MS-018AE, LCC-68	compliant	8542.39.00.01	LCC	68
MT8976AP Microsemi Corporation		查询价格和库存		No	No	Transferred	5 V	CMOS			1	10 mA	INDUSTRIAL	FRAMER	S-PQCC-J44	e0	Not Qualified		85 °C	-40 °C			44	PLASTIC/EPOXY	QCCJ	LDCC44,.7SQ	SQUARE	CHIP CARRIER	YES	Tin/Lead (Sn/Pb)	J BEND	1.27 mm	QUAD				2192	QCCJ, LDCC44,.7SQ	unknown	8542.39.00.01	LPCC	44
PM4358-NGI Microsemi Corporation		查询价格和库存			Yes	Transferred	1.8 V	CMOS			1		INDUSTRIAL	FRAMER	S-PBGA-B256			3	85 °C	-40 °C			256	PLASTIC/EPOXY	BGA		SQUARE	GRID ARRAY	YES		BALL		BOTTOM				2192	BGA,	compliant	8542.39.00.01
MT9074AP1 Microsemi Corporation		查询价格和库存		Yes	Yes	Transferred	5 V		CEPT PCM-30/E-1	T-1(DS1)	1	200 mA	INDUSTRIAL	FRAMER	S-PQCC-J68	e3	Not Qualified		85 °C	-40 °C			68	PLASTIC/EPOXY	QCCJ	LDCC68,1.0SQ	SQUARE	CHIP CARRIER	YES	MATTE TIN	J BEND	1.27 mm	QUAD	24.23 mm	24.23 mm	4.57 mm	2192	LEAD FREE, PLASTIC, MS-018AE, LCC-68	compliant	8542.39.00.01	LCC	68
L-T-8105---SC4-DB LSI Corporation		查询价格和库存		Yes	Yes	Transferred	3.3 V				1	275 µA	COMMERCIAL	TIME SLOT ASSIGNER	S-PQFP-G208	e6	Not Qualified		70 °C				208	PLASTIC/EPOXY	FQFP	QFP208,1.2SQ,20	SQUARE	FLATPACK, FINE PITCH	YES	TIN BISMUTH	GULL WING	500 µm	QUAD	28 mm	28 mm	4.1 mm	2145	FQFP, QFP208,1.2SQ,20	compliant	8542.39.00.01	QFP	208
L-T-8105---BAL4-DB LSI Corporation		查询价格和库存		Yes	Yes	Transferred	3.3 V				1	275 µA	INDUSTRIAL	TIME SLOT ASSIGNER	S-PBGA-B217	e1	Not Qualified		85 °C	-40 °C			217	PLASTIC/EPOXY	BGA	BGA217,17X17,50	SQUARE	GRID ARRAY	YES	TIN SILVER COPPER	BALL	1.27 mm	BOTTOM	23 mm	23 mm	2.32 mm	2145	BGA, BGA217,17X17,50	unknown	8542.39.00.01	BGA	217
L-T-8100A--BAL4-DB LSI Corporation		查询价格和库存		Yes	Yes	Transferred	3.3 V				1	275 µA	INDUSTRIAL	TIME SLOT ASSIGNER	S-PBGA-B217	e1	Not Qualified		85 °C	-40 °C			217	PLASTIC/EPOXY	BGA	BGA217,17X17,50	SQUARE	GRID ARRAY	YES	TIN SILVER COPPER	BALL	1.27 mm	BOTTOM	23 mm	23 mm	2.32 mm	2145	BGA, BGA217,17X17,50	compliant	8542.39.00.01	BGA	217
L-T-8102---SC4-DB LSI Corporation		查询价格和库存		Yes	Yes	Transferred	3.3 V				1	275 µA	COMMERCIAL	TIME SLOT ASSIGNER	S-PQFP-G208	e6	Not Qualified		70 °C				208	PLASTIC/EPOXY	FQFP	QFP208,1.2SQ,20	SQUARE	FLATPACK, FINE PITCH	YES	TIN BISMUTH	GULL WING	500 µm	QUAD	28 mm	28 mm	4.1 mm	2145	FQFP, QFP208,1.2SQ,20	compliant	8542.39.00.01	QFP	208
L-T-8100A--SC4-DB LSI Corporation		查询价格和库存		Yes	Yes	Transferred	3.3 V				1	275 µA	COMMERCIAL	TIME SLOT ASSIGNER	S-PQFP-G208	e6	Not Qualified		70 °C				208	PLASTIC/EPOXY	FQFP	QFP208,1.2SQ,20	SQUARE	FLATPACK, FINE PITCH	YES	TIN BISMUTH	GULL WING	500 µm	QUAD	28 mm	28 mm	4.1 mm	2145	FQFP, QFP208,1.2SQ,20	compliant	8542.39.00.01	QFP	208
L-T-8102---BAL4-DB LSI Corporation		查询价格和库存		Yes	Yes	Transferred	3.3 V				1	275 µA	INDUSTRIAL	TIME SLOT ASSIGNER	S-PBGA-B217	e1	Not Qualified		85 °C	-40 °C			217	PLASTIC/EPOXY	BGA	BGA217,17X17,50	SQUARE	GRID ARRAY	YES	TIN SILVER COPPER	BALL	1.27 mm	BOTTOM	23 mm	23 mm	2.32 mm	2145	BGA, BGA217,17X17,50	unknown	8542.39.00.01	BGA	217
BT8390KPF Synaptics Incorporated		查询价格和库存			No	Active	5 V	CMOS			1	175 mA	COMMERCIAL	FRAMER	R-PQFP-G128	e0	Not Qualified		70 °C				128	PLASTIC/EPOXY	QFP	QFP128,.55X.93,20	RECTANGULAR	FLATPACK	YES	Tin/Lead (Sn/Pb)	GULL WING	500 µm	QUAD				223327797	QFP, QFP128,.55X.93,20	compliant	8542.39.00.01

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