数字传输控制器封装型号_数字传输控制器厂家价格-bom2buy

型号

型号						Most Relevant			Technical					Compliance			Operating Conditions					Physical											Dimensions			Other
型号	数据手册	单价/库存	风险等级	是否无铅	是否Rohs认证	生命周期	标称供电电压	技术	运营商类型	运营商类型（2）	功能数量	最大压摆率	温度等级	电信集成电路类型	JESD-30 代码	JESD-609代码	认证状态	湿度敏感等级	最高工作温度	最低工作温度	峰值回流温度（摄氏度）	处于峰值回流温度下的最长时间	端子数量	封装主体材料	封装代码	封装等效代码	封装形状	封装形式	表面贴装	端子面层	端子形式	端子节距	端子位置	宽度	长度	座面最大高度	mfrid	零件包装代码	包装说明	针数	是否符合REACH标准	HTS代码	Country Of Origin	ECCN代码	YTEOL	Source Content uid
DS21FT40N Rochester Electronics LLC		查询价格和库存				Active	3.3 V	CMOS			1		INDUSTRIAL	FRAMER	S-PBGA-B300	e0	COMMERCIAL		85 °C	-40 °C			300	PLASTIC/EPOXY	BGA		SQUARE	GRID ARRAY	YES	TIN LEAD	BALL	1.27 mm	BOTTOM	27 mm	27 mm	2.54 mm	2178096	BGA	27 X 27 MM, 1.27 MM PITCH, MCMBGA-300	300	unknown
MT8979AE Microsemi Corporation		查询价格和库存		No	No	Transferred	5 V	CMOS	CEPT PCM-30/E-1		1	16 mA	INDUSTRIAL	FRAMER	R-PDIP-T28	e0	Not Qualified		85 °C	-40 °C			28	PLASTIC/EPOXY	DIP	DIP28,.6	RECTANGULAR	IN-LINE	NO	TIN LEAD	THROUGH-HOLE	2.54 mm	DUAL	15.24 mm	37.4 mm	6.35 mm	2192	DIP	DIP-28	28	unknown	8542.39.00.01
MT9076BB Microsemi Corporation		查询价格和库存			No	Transferred	3.3 V				1		INDUSTRIAL	FRAMER	S-PQFP-G80	e0	Not Qualified		85 °C	-40 °C			80	PLASTIC/EPOXY	LQFP		SQUARE	FLATPACK, LOW PROFILE	YES	TIN LEAD	GULL WING	650 µm	QUAD	14 mm	14 mm	1.6 mm	2192	QFP	14 X 14 MM, 1.40 MM HEIGHT, MS-026BEC, LQFP-80	80	unknown	8542.39.00.01
T-8102---SC4-DB LSI Corporation		查询价格和库存		No	No	Transferred	3.3 V				1	275 µA	COMMERCIAL	TIME SLOT ASSIGNER	S-PQFP-G208	e0	Not Qualified		70 °C				208	PLASTIC/EPOXY	FQFP	QFP208,1.2SQ,20	SQUARE	FLATPACK, FINE PITCH	YES	TIN LEAD	GULL WING	500 µm	QUAD	28 mm	28 mm	4.1 mm	2145	QFP	FQFP, QFP208,1.2SQ,20	208	unknown	8542.39.00.01
DS26514GN Maxim Integrated Products		查询价格和库存		No	No	Transferred	1.8 V		CEPT PCM-30/E-1	T-1(DS1)	1	250 µA	INDUSTRIAL	FRAMER	S-PBGA-B256		Not Qualified	3	85 °C	-40 °C			256	PLASTIC/EPOXY	BGA	BGA256,16X16,40	SQUARE	GRID ARRAY	YES		BALL	1 mm	BOTTOM	17 mm	17 mm	1.76 mm	2164	BGA	BGA, BGA256,16X16,40	256	not_compliant	8542.39.00.01	Japan, Mainland China, Malaysia, Philipp... more	EAR99	3
T-8102---BAL4-DB LSI Corporation		查询价格和库存		No	No	Transferred	3.3 V				1	275 µA	INDUSTRIAL	TIME SLOT ASSIGNER	S-PBGA-B217	e0	Not Qualified		85 °C	-40 °C			217	PLASTIC/EPOXY	BGA	BGA217,17X17,50	SQUARE	GRID ARRAY	YES	TIN LEAD	BALL	1.27 mm	BOTTOM	23 mm	23 mm	2.32 mm	2145	BGA	BGA, BGA217,17X17,50	217	compliant	8542.39.00.01
MT8979AC Microsemi Corporation		查询价格和库存			No	Transferred	5 V	CMOS	CEPT PCM-30/E-1		1	15 mA	INDUSTRIAL	FRAMER	R-CDIP-T28	e0	Not Qualified		85 °C	-40 °C			28	CERAMIC, METAL-SEALED COFIRED	DIP	DIP28,.6	RECTANGULAR	IN-LINE	NO	Tin/Lead (Sn/Pb)	THROUGH-HOLE	2.54 mm	DUAL	10.16 mm	36.83 mm	6.35 mm	2192	DIP	DIP-28	28	unknown	8542.39.00.01
T-8100A--BAL4-DB LSI Corporation		查询价格和库存		No	No	Transferred	3.3 V				1	275 µA	INDUSTRIAL	TIME SLOT ASSIGNER	S-PBGA-B217	e0	Not Qualified		85 °C	-40 °C			217	PLASTIC/EPOXY	BGA	BGA217,17X17,50	SQUARE	GRID ARRAY	YES	TIN LEAD	BALL	1.27 mm	BOTTOM	23 mm	23 mm	2.32 mm	2145	BGA	PLASTIC, BGA-217	217	unknown	8542.39.00.01
L-TTSI004161BL-2 LSI Corporation		查询价格和库存		Yes	Yes	Transferred	1.5 V				1		INDUSTRIAL	TIME SLOT ASSIGNER	S-PBGA-B240	e1	Not Qualified		85 °C	-40 °C			240	PLASTIC/EPOXY	BGA		SQUARE	GRID ARRAY	YES	TIN SILVER COPPER	BALL	1 mm	BOTTOM	19 mm	19 mm	2.07 mm	2145	BGA	BGA,	240	compliant	8542.39.00.01
DS2155GNB+ Rochester Electronics LLC		查询价格和库存		Yes	Yes	Active	3.3 V				1		INDUSTRIAL	FRAMER	S-PBGA-B100	e1	COMMERCIAL	3	85 °C	-40 °C	260	NOT SPECIFIED	100	PLASTIC/EPOXY	FBGA		SQUARE	GRID ARRAY, FINE PITCH	YES	TIN SILVER COPPER	BALL	800 µm	BOTTOM	10 mm	10 mm		2178096	BGA	10 X 10 MM, ROHS COMPLIANT, CSBGA-100	100	unknown
XRT86VL30IV Exar Corporation		查询价格和库存		No	No	Transferred	1.8 V				1		INDUSTRIAL	FRAMER	R-PQFP-G128	e0	Not Qualified		85 °C	-40 °C			128	PLASTIC/EPOXY	LFQFP		RECTANGULAR	FLATPACK, LOW PROFILE, FINE PITCH	YES	TIN LEAD	GULL WING	500 µm	QUAD	14 mm	20 mm	1.6 mm	1972	QFP	14 X 20 MM, 1.40 MM HEIGHT, LQFP-128	128	compliant	8542.39.00.01
PEB2035-P Siemens		查询价格和库存				Transferred	5 V	CMOS			1		COMMERCIAL	FRAMER	R-PDIP-T40		Not Qualified		70 °C				40	PLASTIC/EPOXY			RECTANGULAR	IN-LINE	NO		THROUGH-HOLE		DUAL				2403	DIP	,	40	unknown	8542.39.00.01
82V8313BBG Integrated Device Technology Inc		查询价格和库存		Yes	Yes	Transferred	3.3 V				1		INDUSTRIAL	FRAMER	S-PBGA-B208	e1	Not Qualified	3	85 °C	-40 °C			208	PLASTIC/EPOXY	BGA		SQUARE	GRID ARRAY	YES	TIN SILVER COPPER	BALL	1 mm	BOTTOM	17 mm	17 mm	1.97 mm	2068	BGA	17 X 17 MM, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-208	208	compliant	8542.39.00.01				82V8313BBG
L-TTSI001041BL-2 LSI Corporation		查询价格和库存		Yes	Yes	Transferred	1.5 V				1		INDUSTRIAL	TIME SLOT ASSIGNER	S-PBGA-B240	e1	Not Qualified		85 °C	-40 °C	260	40	240	PLASTIC/EPOXY	BGA		SQUARE	GRID ARRAY	YES	Tin/Silver/Copper (Sn/Ag/Cu)	BALL	1 mm	BOTTOM	19 mm	19 mm	2.07 mm	2145	BGA	BGA,	240	compliant	8542.39.00.01
L-TTSI002081BL-2 LSI Corporation		查询价格和库存		Yes	Yes	Transferred	1.5 V				1		INDUSTRIAL	TIME SLOT ASSIGNER	S-PBGA-B240	e1	Not Qualified		85 °C	-40 °C			240	PLASTIC/EPOXY	BGA		SQUARE	GRID ARRAY	YES	TIN SILVER COPPER	BALL	1 mm	BOTTOM	19 mm	19 mm	2.07 mm	2145	BGA	BGA,	240	unknown	8542.39.00.01
L-TFRA84J131BL-3 LSI Corporation		查询价格和库存		Yes	Yes	Transferred	1.5 V				1		INDUSTRIAL	FRAMER	S-PBGA-B909	e1	Not Qualified		85 °C	-40 °C			909	PLASTIC/EPOXY	BGA		SQUARE	GRID ARRAY	YES	TIN SILVER COPPER	BALL	1 mm	BOTTOM	35 mm	35 mm	2.51 mm	2145	BGA	BGA,	909	compliant	8542.39.00.01
T-8100A--SC4-DB LSI Corporation		查询价格和库存		No	No	Transferred	3.3 V				1	275 µA	COMMERCIAL	TIME SLOT ASSIGNER	S-PQFP-G208	e0	Not Qualified		70 °C				208	PLASTIC/EPOXY	FQFP	QFP208,1.2SQ,20	SQUARE	FLATPACK, FINE PITCH	YES	TIN LEAD	GULL WING	500 µm	QUAD	28 mm	28 mm	4.1 mm	2145	QFP	PLASTIC, SQFP-208	208	compliant	8542.39.00.01
PM4358-NI Microsemi Corporation		查询价格和库存			No	Transferred	1.8 V	CMOS			1		INDUSTRIAL	FRAMER	S-PBGA-B256				85 °C	-40 °C	NOT SPECIFIED	NOT SPECIFIED	256	PLASTIC/EPOXY	BGA		SQUARE	GRID ARRAY	YES		BALL		BOTTOM				2192		17 X 17 MM, CABGA-256		unknown	8542.39.00.01
XRT86VL30IV80 Exar Corporation		查询价格和库存		No	No	Transferred	1.8 V				1		INDUSTRIAL	FRAMER	S-PQFP-G80	e0	Not Qualified		85 °C	-40 °C			80	PLASTIC/EPOXY	LFQFP		SQUARE	FLATPACK, LOW PROFILE, FINE PITCH	YES	TIN LEAD	GULL WING	500 µm	QUAD	12 mm	12 mm	1.6 mm	1972	QFP	LFQFP,	80	compliant	8542.39.00.01
82V2108BB Integrated Device Technology Inc		查询价格和库存		No	No	Transferred	3.3 V	CMOS			1		INDUSTRIAL	FRAMER	S-PBGA-B144	e0	Not Qualified	3	85 °C	-40 °C	225	30	144	PLASTIC/EPOXY	BGA	BGA144,12X12,40	SQUARE	GRID ARRAY	YES	TIN LEAD	BALL	1 mm	BOTTOM	13 mm	13 mm	1.97 mm	2068	BGA	PLASTIC, BGA-144	144	not_compliant	8542.39.00.01				82V2108BB

型号						Most Relevant			Technical					Compliance			Operating Conditions					Physical											Dimensions			Other
型号	数据手册	单价/库存	风险等级	是否无铅	是否Rohs认证	生命周期	标称供电电压	技术	运营商类型	运营商类型（2）	功能数量	最大压摆率	温度等级	电信集成电路类型	JESD-30 代码	JESD-609代码	认证状态	湿度敏感等级	最高工作温度	最低工作温度	峰值回流温度（摄氏度）	处于峰值回流温度下的最长时间	端子数量	封装主体材料	封装代码	封装等效代码	封装形状	封装形式	表面贴装	端子面层	端子形式	端子节距	端子位置	宽度	长度	座面最大高度	mfrid	零件包装代码	包装说明	针数	是否符合REACH标准	HTS代码	Country Of Origin	ECCN代码	YTEOL	Source Content uid
DS21FT40N Rochester Electronics LLC		查询价格和库存				Active	3.3 V	CMOS			1		INDUSTRIAL	FRAMER	S-PBGA-B300	e0	COMMERCIAL		85 °C	-40 °C			300	PLASTIC/EPOXY	BGA		SQUARE	GRID ARRAY	YES	TIN LEAD	BALL	1.27 mm	BOTTOM	27 mm	27 mm	2.54 mm	2178096	BGA	27 X 27 MM, 1.27 MM PITCH, MCMBGA-300	300	unknown
MT8979AE Microsemi Corporation		查询价格和库存		No	No	Transferred	5 V	CMOS	CEPT PCM-30/E-1		1	16 mA	INDUSTRIAL	FRAMER	R-PDIP-T28	e0	Not Qualified		85 °C	-40 °C			28	PLASTIC/EPOXY	DIP	DIP28,.6	RECTANGULAR	IN-LINE	NO	TIN LEAD	THROUGH-HOLE	2.54 mm	DUAL	15.24 mm	37.4 mm	6.35 mm	2192	DIP	DIP-28	28	unknown	8542.39.00.01
MT9076BB Microsemi Corporation		查询价格和库存			No	Transferred	3.3 V				1		INDUSTRIAL	FRAMER	S-PQFP-G80	e0	Not Qualified		85 °C	-40 °C			80	PLASTIC/EPOXY	LQFP		SQUARE	FLATPACK, LOW PROFILE	YES	TIN LEAD	GULL WING	650 µm	QUAD	14 mm	14 mm	1.6 mm	2192	QFP	14 X 14 MM, 1.40 MM HEIGHT, MS-026BEC, LQFP-80	80	unknown	8542.39.00.01
T-8102---SC4-DB LSI Corporation		查询价格和库存		No	No	Transferred	3.3 V				1	275 µA	COMMERCIAL	TIME SLOT ASSIGNER	S-PQFP-G208	e0	Not Qualified		70 °C				208	PLASTIC/EPOXY	FQFP	QFP208,1.2SQ,20	SQUARE	FLATPACK, FINE PITCH	YES	TIN LEAD	GULL WING	500 µm	QUAD	28 mm	28 mm	4.1 mm	2145	QFP	FQFP, QFP208,1.2SQ,20	208	unknown	8542.39.00.01
DS26514GN Maxim Integrated Products		查询价格和库存		No	No	Transferred	1.8 V		CEPT PCM-30/E-1	T-1(DS1)	1	250 µA	INDUSTRIAL	FRAMER	S-PBGA-B256		Not Qualified	3	85 °C	-40 °C			256	PLASTIC/EPOXY	BGA	BGA256,16X16,40	SQUARE	GRID ARRAY	YES		BALL	1 mm	BOTTOM	17 mm	17 mm	1.76 mm	2164	BGA	BGA, BGA256,16X16,40	256	not_compliant	8542.39.00.01	Japan, Mainland China, Malaysia, Philipp... more	EAR99	3
T-8102---BAL4-DB LSI Corporation		查询价格和库存		No	No	Transferred	3.3 V				1	275 µA	INDUSTRIAL	TIME SLOT ASSIGNER	S-PBGA-B217	e0	Not Qualified		85 °C	-40 °C			217	PLASTIC/EPOXY	BGA	BGA217,17X17,50	SQUARE	GRID ARRAY	YES	TIN LEAD	BALL	1.27 mm	BOTTOM	23 mm	23 mm	2.32 mm	2145	BGA	BGA, BGA217,17X17,50	217	compliant	8542.39.00.01
MT8979AC Microsemi Corporation		查询价格和库存			No	Transferred	5 V	CMOS	CEPT PCM-30/E-1		1	15 mA	INDUSTRIAL	FRAMER	R-CDIP-T28	e0	Not Qualified		85 °C	-40 °C			28	CERAMIC, METAL-SEALED COFIRED	DIP	DIP28,.6	RECTANGULAR	IN-LINE	NO	Tin/Lead (Sn/Pb)	THROUGH-HOLE	2.54 mm	DUAL	10.16 mm	36.83 mm	6.35 mm	2192	DIP	DIP-28	28	unknown	8542.39.00.01
T-8100A--BAL4-DB LSI Corporation		查询价格和库存		No	No	Transferred	3.3 V				1	275 µA	INDUSTRIAL	TIME SLOT ASSIGNER	S-PBGA-B217	e0	Not Qualified		85 °C	-40 °C			217	PLASTIC/EPOXY	BGA	BGA217,17X17,50	SQUARE	GRID ARRAY	YES	TIN LEAD	BALL	1.27 mm	BOTTOM	23 mm	23 mm	2.32 mm	2145	BGA	PLASTIC, BGA-217	217	unknown	8542.39.00.01
L-TTSI004161BL-2 LSI Corporation		查询价格和库存		Yes	Yes	Transferred	1.5 V				1		INDUSTRIAL	TIME SLOT ASSIGNER	S-PBGA-B240	e1	Not Qualified		85 °C	-40 °C			240	PLASTIC/EPOXY	BGA		SQUARE	GRID ARRAY	YES	TIN SILVER COPPER	BALL	1 mm	BOTTOM	19 mm	19 mm	2.07 mm	2145	BGA	BGA,	240	compliant	8542.39.00.01
DS2155GNB+ Rochester Electronics LLC		查询价格和库存		Yes	Yes	Active	3.3 V				1		INDUSTRIAL	FRAMER	S-PBGA-B100	e1	COMMERCIAL	3	85 °C	-40 °C	260	NOT SPECIFIED	100	PLASTIC/EPOXY	FBGA		SQUARE	GRID ARRAY, FINE PITCH	YES	TIN SILVER COPPER	BALL	800 µm	BOTTOM	10 mm	10 mm		2178096	BGA	10 X 10 MM, ROHS COMPLIANT, CSBGA-100	100	unknown
XRT86VL30IV Exar Corporation		查询价格和库存		No	No	Transferred	1.8 V				1		INDUSTRIAL	FRAMER	R-PQFP-G128	e0	Not Qualified		85 °C	-40 °C			128	PLASTIC/EPOXY	LFQFP		RECTANGULAR	FLATPACK, LOW PROFILE, FINE PITCH	YES	TIN LEAD	GULL WING	500 µm	QUAD	14 mm	20 mm	1.6 mm	1972	QFP	14 X 20 MM, 1.40 MM HEIGHT, LQFP-128	128	compliant	8542.39.00.01
PEB2035-P Siemens		查询价格和库存				Transferred	5 V	CMOS			1		COMMERCIAL	FRAMER	R-PDIP-T40		Not Qualified		70 °C				40	PLASTIC/EPOXY			RECTANGULAR	IN-LINE	NO		THROUGH-HOLE		DUAL				2403	DIP	,	40	unknown	8542.39.00.01
82V8313BBG Integrated Device Technology Inc		查询价格和库存		Yes	Yes	Transferred	3.3 V				1		INDUSTRIAL	FRAMER	S-PBGA-B208	e1	Not Qualified	3	85 °C	-40 °C			208	PLASTIC/EPOXY	BGA		SQUARE	GRID ARRAY	YES	TIN SILVER COPPER	BALL	1 mm	BOTTOM	17 mm	17 mm	1.97 mm	2068	BGA	17 X 17 MM, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-208	208	compliant	8542.39.00.01				82V8313BBG
L-TTSI001041BL-2 LSI Corporation		查询价格和库存		Yes	Yes	Transferred	1.5 V				1		INDUSTRIAL	TIME SLOT ASSIGNER	S-PBGA-B240	e1	Not Qualified		85 °C	-40 °C	260	40	240	PLASTIC/EPOXY	BGA		SQUARE	GRID ARRAY	YES	Tin/Silver/Copper (Sn/Ag/Cu)	BALL	1 mm	BOTTOM	19 mm	19 mm	2.07 mm	2145	BGA	BGA,	240	compliant	8542.39.00.01
L-TTSI002081BL-2 LSI Corporation		查询价格和库存		Yes	Yes	Transferred	1.5 V				1		INDUSTRIAL	TIME SLOT ASSIGNER	S-PBGA-B240	e1	Not Qualified		85 °C	-40 °C			240	PLASTIC/EPOXY	BGA		SQUARE	GRID ARRAY	YES	TIN SILVER COPPER	BALL	1 mm	BOTTOM	19 mm	19 mm	2.07 mm	2145	BGA	BGA,	240	unknown	8542.39.00.01
L-TFRA84J131BL-3 LSI Corporation		查询价格和库存		Yes	Yes	Transferred	1.5 V				1		INDUSTRIAL	FRAMER	S-PBGA-B909	e1	Not Qualified		85 °C	-40 °C			909	PLASTIC/EPOXY	BGA		SQUARE	GRID ARRAY	YES	TIN SILVER COPPER	BALL	1 mm	BOTTOM	35 mm	35 mm	2.51 mm	2145	BGA	BGA,	909	compliant	8542.39.00.01
T-8100A--SC4-DB LSI Corporation		查询价格和库存		No	No	Transferred	3.3 V				1	275 µA	COMMERCIAL	TIME SLOT ASSIGNER	S-PQFP-G208	e0	Not Qualified		70 °C				208	PLASTIC/EPOXY	FQFP	QFP208,1.2SQ,20	SQUARE	FLATPACK, FINE PITCH	YES	TIN LEAD	GULL WING	500 µm	QUAD	28 mm	28 mm	4.1 mm	2145	QFP	PLASTIC, SQFP-208	208	compliant	8542.39.00.01
PM4358-NI Microsemi Corporation		查询价格和库存			No	Transferred	1.8 V	CMOS			1		INDUSTRIAL	FRAMER	S-PBGA-B256				85 °C	-40 °C	NOT SPECIFIED	NOT SPECIFIED	256	PLASTIC/EPOXY	BGA		SQUARE	GRID ARRAY	YES		BALL		BOTTOM				2192		17 X 17 MM, CABGA-256		unknown	8542.39.00.01
XRT86VL30IV80 Exar Corporation		查询价格和库存		No	No	Transferred	1.8 V				1		INDUSTRIAL	FRAMER	S-PQFP-G80	e0	Not Qualified		85 °C	-40 °C			80	PLASTIC/EPOXY	LFQFP		SQUARE	FLATPACK, LOW PROFILE, FINE PITCH	YES	TIN LEAD	GULL WING	500 µm	QUAD	12 mm	12 mm	1.6 mm	1972	QFP	LFQFP,	80	compliant	8542.39.00.01
82V2108BB Integrated Device Technology Inc		查询价格和库存		No	No	Transferred	3.3 V	CMOS			1		INDUSTRIAL	FRAMER	S-PBGA-B144	e0	Not Qualified	3	85 °C	-40 °C	225	30	144	PLASTIC/EPOXY	BGA	BGA144,12X12,40	SQUARE	GRID ARRAY	YES	TIN LEAD	BALL	1 mm	BOTTOM	13 mm	13 mm	1.97 mm	2068	BGA	PLASTIC, BGA-144	144	not_compliant	8542.39.00.01				82V2108BB

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